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福特中國 · 新能源技術及數(shù)字化 EVD

動力電池控制模塊 – 驗證與投產工程師 BECM/BMS Validation & Launch Engineer

薪資面議  /  南京

2025-04-02 更新

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職位屬性

  • 招聘類型:社招
  • 工作性質:全職
  • 事業(yè)部:BEV電動車
  • CDSID:YLIU386

職位描述

Responsibilities:

? Ensure the quality of BECM / BMS launch event, verify launch quality during PPAP, spot issues at global and local supplier site, solve launch issues (incl. solder defect, IC defect under SEM…etc.), deliver gap assessment and track for closing the gap.

負責確保并提升投產質量,,在PPAP中分階段執(zhí)行相應任務:在國內以及全球供應商駐場,發(fā)現(xiàn)并解決投產當中的各類問題(包括但不限于解決焊接質量,,識別并引導供應商解決零部件級別問題,,例如芯片缺陷等),,提交問題與差距分析報告并且負責消弭差距。

? Get familiar with Ford manufacturing requirement and DV. Define manufacture requirements for suppliers. Perform assessment on the process feasibility and robustness (e.g. deep dive on SMT / wave soldering spec / workstation design sequence & logic…etc.) and summarize suppliers’ manufacturing capability during sourcing via either online meeting or on-site visit. Deliver capability and gap assessment with expertise for suppliers.

熟悉福特制造基礎流程與要求,,以此設立供應商生產要求,。針對不同供應商產線設計與方案(SMT,波峰焊,,工位設計邏輯等等)做出可行性與可靠性評判,,并找出潛在問題點。運用自身產線經驗與專業(yè),,針對供應商交付差距項分析

? Develop BECM DVP and conduct DV&PV at test lab, deliver qualified report.

交付并完善DV計劃,,現(xiàn)場監(jiān)督執(zhí)行DV&PV,交付實驗報告

? Cooperate with layout team to deliver PCB layout without manufacturing issue. Deliver launch & quality issue assessment and solve together with core & application team.

與PCB布局團隊一起交付符合制造要求的設計,。與核心研發(fā)團隊以及應用團隊一起解決投產問題跟質量問題

? Travel domestic & international.

工作需要國內/國際出差與供應商常駐

 

任職條件

 

? 3~5 years’ experience of ECU / phone / control related circuit board launch & validation, prefered with experience of BMS, IC failure or related design experience.

3~5年ECU或電子產品投產跟驗證經驗,,有BMS/BECM投產經驗,IC失效分析經驗優(yōu)先

? Familiar with PPAP and PCBA manufacturing process, general requirements and spec, including but not limited to SMT spec, IPC Class, Gage R&R..etc. Experience with solving manufacturing issues. Know-how with IC analysis tool.

熟悉PPAP與PCBA制造工藝流程,,基礎要求以及規(guī)范,,包括但不限于:基礎的SMT規(guī)范,IPC等級對應的工藝要求與結果判斷,,PPAP中的量具R&R等,。具備解決投產與量產棘手問題的經驗,了解芯片失效分析工具,,能針對IC供應商提交的芯片失效報告進行分析與判斷,。

? Master Degree in Microelectronics Engineering/Electrical Engineering/Automation is preferred.

電子/電氣/自動化碩士優(yōu)先

? English Skill: Proficiency

英文要求:溝通熟練

? Strong Communication, Planning Skills and Self-Starter capable of delivering results.

希望您能有較強的溝通與計劃能力,內驅力強,,交付成果為導向

? Demonstrated initiative, discover the flaw in process during development. Integrity and teamwork orientation

希望您能有主動性,,善于預測并糾正開發(fā)中的制造流程隱患,為人正直并具有團隊合作精神,。